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- PLP Advanced packaging technology development engineer(Full time)
PLP Advanced packaging technology development engineer(Full time)
2022.06.29
| 職務屬性: Attributes |
全職 Full time |
| 職務名稱 Job title |
先進封裝技術開發工程師 PLP Advanced packaging technology development engineer |
| 工作地點 work place |
Tainan |
| 工作內容 Job description |
1.電性設計模擬開發工程師 Electric simulation design engineer 2.前瞻製程開發工程師 Advance Process engineer |
| 教育程度 Education level |
Master/ PhD |
| 學歷科系 Academic Department |
Science and engineering background |
| 工作經驗 work experience |
non |
| 薪資待遇 Salary |
Monthly salary of more than NTD53,000 |
| 聯絡窗口 contact window |
鄭怡婷 (ITING.CHENG) (06)-5051888-47040 / |