成大材料系
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Professor

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Kwang-Lung Lin
Kwang-Lung Lin

Professor

Kwang-Lung LinChair Professor

  • Phone： (06) 275-7575 ext.62929
  • E-mail：matkllin@mail.ncku.edu.tw
  • Lab：Electronic Packaging Laboratory (EPL)
  • Personal Web Site：Website link
  • Research Expertise：Microelectronics Interconnect: Solder (flip chip, BGA, 3D IC microbump), Wire Bond (Cu wire, Ag Wire, Au Wire), Carbon Nanotube
    Electromigration/Thermomigration/Interfacial Reaction/Wettability
    Development of Low/High temperature Pb-free solder
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期刊論文

  1. Ying-Ta Chiu*;Kwang-Lung Lin;Albert T. Wu;Wei-Luen Jang;Chung-Li Dong;Yi-Shao Lai,"Electrorecrystallization of Metal Alloy",J Alloy and Compound;vol : 549, no : , pp : 190- 194(SCI 01 2013)[link]
  2. Yu-Wei Lin*;Kwang-Lung Lin,"Nucleation behaviors of the intermetallic compounds at the initial interfacial reaction between the liquid Sn3.0Ag0.5Cu solder and Ni substrate during reflow",Intermetallics;vol : 32, no : , pp : 6- 11(SCI 01 2013)[link]
  3. Nai-Shuo Liu*;Kwang-Lung Lin,"Effect of Ga on the Oxidation Properties of Sn–8.5Zn–0.5Ag–0.1Al–xGa Solders",Oxidation of Metals;vol : 78, no : 5-6, pp : 285- 294(SCI 12 2012)[link]
  4. Kwang-Lung Lin*;Yu-Wei Lin;Chang-Ho Yu,"The Interphases Formed During the Very Early Stage Liquid Solder/Metal Substrate Interaction of the Soldering Process",JOM (The Journal of The Minerals, Metals & Materials Society );vol : 64, no : 10, pp : 1184- 1189(SCI 10 2012)[link]
  5. Wei-Yu Chen*;Tsung-Chieh Chiu;Kwang-Lung Lin;Yi-Shao Lai,"Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint",Intermetallics;vol : 26, no : , pp : 40- 43(SCI 07 2012)[link]
  6. Jagjiwan Mittal;Kwang Lung Lin*,"Diffusion of Cu and interfacial reactions during reflow of Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga alloy on Ni/Cu substrate",Journal of Materials Research;vol : 27, no : 8, pp : 1142- 1148(SCI 04 2012)[link]
  7. Wei-Luen Jang;Tai-Siang Wang;Yen-Fen Lai;Kwang-Lung Lin*;Yi-Shao Lai,"The performance and fracture mechanism of solder joints under mechanical reliability test",Microelectronics Reliability;, pp : http://dx.doi.org/10.1016/j.mi- (SCI 04 2012)[link]
  8. Ying-Ta Chiu;Kwang-Lung Lin*;Yi-Shao Lai,"Dissolution of Sn in a SnPb solder bump under current stressing",Journal of Applied Physics;vol : 111, no : , pp : 043517- (SCI 02 2012)[link]
  9. Tsung-Chieh Chiu*;Kwang-Lung Lin,"The Growth of Intermetallic Compound in Cu/Sn3.5Ag/Au Solder Joints under Current Stressing",Intermetallics;vol : 23, no : , pp : 208- 216(SCI 04 2012)[link]
  10. YU-HSIANG HSIAO*;KWANG-LUNG LIN;CHIU-WEN LEE;YU-HSIU SHAO;YI-SHAO LAI,"Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates",Journal of Electronic Materials;vol : 41, no : 12, pp : 3368- 3374(SCI 12 2012)[link]
  11. De-Shin Liu;Chang-Lin Hsu*;Chia-Yuan Kuo;Ya-Ling Huang;Kwang-Lung Lin;Geng-Shin Shen,"A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead-free solder joints",Soldering & Surface Mount Technology;vol : 24, no : 1, pp : 22- 29(SCI 01 2012)[link]
  12. P. J. Tsai;T. C. Chiu;P. H. Tsai;K. L. Lin;K. S. Lin;S. L. I. Chan*,"Carbon nanotube buckypaper/MmNi5 composite film as anode for Ni/MH batteriesCarbon nanotube buckypaper/MmNi5 composite film as anode for Ni/MH batteries",International Journal of Hydrogen Energy;vol : 37, no : 4, pp : 3494- 3499(SCI 02 2012)[link]
  13. Ying-Ta Chiu*;Chia-Hao Liu;Kwang-Lung Lin;Yi-Shao Lai,"Supersaturation Induced by Current Stressing",Scripta Materialia;vol : 65, no : , pp : 615- 617(SCI 07 2011)[link]
  14. Jagjiwan Mittal;Kwang Lung Lin*,"The formation of electric circuits with carbon nanotubes and copper using tin solder",CARBON;vol : 49, no : , pp : 4385- 4391(SCI 06 2011)[link]
  15. Chau, J.L.H.;Chen, C.-Y.;Yang, M.-C.;Lin, K.-L.;Sato, S.;Nakamura, T.;Yang, C.-C.;Cheng, C.-W.,"Femtosecond laser synthesis of bimetallic Pt-Au nanoparticles",Materials Letters;vol : 65, no : 4, pp : 804- 807(SCI 02 2011)[link]
  16. Wei-Luen Jang*;Tsung-Chieh Chiu;Kwang-Lun Lin,"Effect of Thermal Cycles on Adhesion Strength of Ag/Ni/Ti film on AlN Substrate",Thin Solid Films;vol : 519, no : 16, pp : 5539- 5543(SCI 06 2011)[link]
  17. Chien-Cheng Pan;Kwang-Lung Lin,"The interfacial amorphous double layer and the homogeneous nucleation in reflow of a Sn-Zn solder on Cu substrate",JOURNAL OF APPLIED PHYSICS;vol : 109, no : 103513, pp : 103513-1- 103513-4(SCI2011)[link]
  18. Yu-Wei Lin;Kwang-Lung Lin,"The early stage dissolution of Ni and the nucleation of Ni-Sn intermetallic compound at the interface during the soldering of Sn-3.5Ag on a Ni substrate",JOURNAL OF APPLIED PHYSICS; JOURNAL OF APPLIED PHYSICSvol : 108, no : 6, pp : 063536- (SCI 09 2010)[link]
  19. Y.L. Huang;K.L. Lin;D.S. Liu,"Microstructure evolution and microimpact performance of Sn-Ag-Cu solder joints under thermal cycle test",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 25, no : 7, pp : 1312- 1320(SCI 07 2010)[link]
  20. J. Mittal;K.L. Lin,"Activities during melting and reflowing behaviour of solders",Soldering & Surface Mount Technology;Soldering & Surface Mount Technologyvol : 22, no : 1, pp : 4- 10(SCI2010)[link]
  21. Jagjiwan Mittal;Yu Wei Lin;Kwang Lung Lin,"Influence of Cu substrate surface oxides and heating rates during reflow on melting point of Sn–3.5Ag solder",Applied Surface Science; Applied Surface Sciencevol : 256, no : 11, pp : 3531- 3540(SCI 03 2010)[link]
  22. Chiu TC;Lin KL,"The difference in the types of intermetallic compound formed between the cathode and anode of an Sn-Ag-Cu solder joint under current stressing",INTERMETALLICS; INTERMETALLICSvol : 17, no : 12, pp : 1105- 1114(SCI 12 2009)[link]
  23. Kuo SM;Lin KL,"Recrystallization under electromigration of a solder alloy",JOURNAL OF APPLIED PHYSICS; JOURNAL OF APPLIED PHYSICSvol : 106, no : 2, pp : 023514- (SCI 07 2009)[link]
  24. Chiu TC;Lin KL,"The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint",SCRIPTA MATERIALIA; SCRIPTA MATERIALIAvol : 60, no : 12, pp : 1121- 1124(SCI 06 2009)[link]
  25. Hsuan TC;Lin KL,"Microstructural evolution of epsilon-AgZn3 and eta-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder during aging treatment",JOURNAL OF ALLOYS AND COMPOUNDS; JOURNAL OF ALLOYS AND COMPOUNDSvol : 469, no : 1-2, pp : 350- 356(SCI 02 2009)[link]
  26. Wu YK;Lin KL;Salam B,"Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 38, no : 2, pp : 227- 230(SCI 02 2009)[link]
  27. Lai RS;Lin KL;Salam B,"Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 38, no : 1, pp : 88- 92(SCI 01 2009)[link]
  28. Mittal J;Kuo SM;Lin YW;Lin KL,"Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 38, no : 12, pp : 2436- 2442(SCI 12 2009)[link]
  29. Yeh TK;Lin KL;Salam B,"Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders",SOLDERING & SURFACE MOUNT TECHNOLOGY; SOLDERING & SURFACE MOUNT TECHNOLOGYvol : 21, no : 4, pp : 19- 23(SCI2009)[link]
  30. Kuo SM;Lin KL,"Electromigration-induced void formation at the Cu5Zn8/solder interface in a Cu/Sn-9Zn/Cu sandwich",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 37, no : 10, pp : 1611- 1617(SCI 10 2008)[link]
  31. Pan CC;Yu CH;Lin KL,"The amorphous origin and the nucleation of intermetallic compounds formed at the interface during the soldering of Sn-3.0Ag-0.5Cu on a Cu substrate",APPLIED PHYSICS LETTERS; APPLIED PHYSICS LETTERSvol : 93, no : 06, pp : 1912- 1914(SCI 08 2008)[link]
  32. Chiu YT;Lin KL;Lai YS,"Orientation transformation of Pb grains in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints during electromigration test",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 23, no : 7, pp : 1877- 1881(SCI 07 2008)[link]
  33. Liu NS;Lin KL,"Evolution of interfacial morphology of Sn-8.5Zn-0.5Ag-0.1Al-xGa/Cu system during isothermal aging",JOURNAL OF ALLOYS AND COMPOUNDS; JOURNAL OF ALLOYS AND COMPOUNDSvol : 456, no : 1-2, pp : 466- 473(SCI 05 2008)[link]
  34. Huang YL;Lin KL;Liu DS,"The micro-impact fracture behavior of lead-free solder ball joints",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 23, no : 4, pp : 1057- 1063(SCI 04 2008)[link]
  35. Kuo SM;Lin KL,"Polarity effect of electromigration on intermetallic compound formation in a Cu/Sn-9Zn/Cu sandwich",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 23, no : 4, pp : 1087- 1094(SCI 04 2008)[link]
  36. Lin KL;Shih PC,"IMC formation on BGA package with Sn-Ag-Cu and Sn-Ag-Cu-Ni-Ge solder balls",JOURNAL OF ALLOYS AND COMPOUNDS; JOURNAL OF ALLOYS AND COMPOUNDSvol : 452, no : 2, pp : 291- 297(SCI 03 2008)[link]
  37. Lai RS;Lin KL;Salam B,"Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free solders",SOLDERING & SURFACE MOUNT TECHNOLOGY; SOLDERING & SURFACE MOUNT TECHNOLOGYvol : 20, no : 1, pp : 22- 26(SCI2008)[link]
  38. Mohanty US;Lin KL,"Electrochemical corrosion behaviour of Pb-free Sn-8.5Zn-0.05Al-XGa and Sn-3Ag-0.5Cu alloys in chloride containing aqueous solution",CORROSION SCIENCE; CORROSION SCIENCEvol : 50, no : 9, pp : 2437- 2443(SCI 09 2008)[link]
  39. Lin KL;Chen SY;Mohanty US,"Effect of current density and plating time on the morphology of copper electrodeposits on an AFM tip",JOURNAL OF THE ELECTROCHEMICAL SOCIETY; JOURNAL OF THE ELECTROCHEMICAL SOCIETYvol : 155, no : 4, pp : 251- 255(SCI2008)[link]
  40. Chiu TC;Lin KL,"Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 23, no : 1, pp : 264- 273(SCI 01 2008)[link]
  41. Shih, PC;Lin, KL,"Correlation between interfacial microstructure and shear behavior of Sn-Ag-Cu solder ball joined with Sn-Zn-Bi paste",Journal of Materials Science; Journal of Materials Sciencevol : 42, no : , pp : 2574- 2581(SCI 04 2007)[link]
  42. Kuo, SM;Lin, KL,"Microstructure evolution during electromigration between Sn-9Zn solder and Cu",J. Materials Research; J. Materials Researchvol : 22, no : , pp : 1240- 1249(SCI 05 2007)[link]
  43. Shih, PC;Lin, KL,"Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 degrees C",J. Materials Research; J. Materials Researchvol : 22, no : , pp : 113- 123(SCI 01 2007)[link]
  44. Hsuan, TC;Lin, KL,"Effects of aging treatment on mechanical properties and microstructure of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga Solder",Materials Science & Engineering A; Materials Science & Engineering Avol : 456, no : , pp : 202- 209(SCI 05 2007)[link]
  45. Kuo, SM;Lin, KL,"The hillock formation in a Cu/Sn-9Zn/Cu lamella upon current stressing",J. Electronic Materials; J. Electronic Materialsvol : 36, no : , pp : 1378- 1382(SCI 10 2007)[link]
  46. Shih, PC;Lin, KL,"Spallation of interfacial Ag-Au-Cu-Zn compounds in Sn-Ag-Cu/Sn-Zn-Bi joints during 210 degrees C reflow",Journal of Alloys and Compounds; Journal of Alloys and Compoundsvol : 439, no : , pp : 137- 142(SCI 07 2007)[link]
  47. Mohanty, US;Lin, KL,"The polarization characteristics of Pb-free Sn-8.5Zn-XAg-0.1A1-0.05Ga alloy in 3.5% NaCl solution",Corrosion Science; Corrosion Sciencevol : 49, no : , pp : 2815- 2831(SCI 07 2007)[link]
  48. Mohanty, US;Lin, KL,"Electrochemical corrosion study of Sn-XAg-0.5Cu alloys in 3.5% NaCl solution",J. Materials Research;J. Materials Researchvol : 22, no : , pp : 2573- 2581(SCI 09 2007)[link]
  49. Yeh, PY;Song, JM;Lin, KL,"Dissolution behavior of Cu and Ag substrates in molten solders",J. Electronic Materials; J. Electronic Materialsvol : 35, no : , pp : 978- 987(SCI 05 2006)[link]
  50. Huang, CW;Lin, KL,"Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates",Journal ofElectronic Materials; Journal ofElectronic Materialsvol : 35, no : , pp : 2135- 2141(SCI 12 2006)[link]
  51. Shih, PC;Lin, KL,"Interfacial microstructure and shear behavior of Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste",Journal of Alloys and Compounds; Journal of Alloys and Compoundsvol : 422, no : , pp : 153- 163(SCI 09 2006)[link]
  52. Mohanty, US;Lin, KL,"Potentiodynamic polarization measurement of Sn-8.5Zn-XAl-0.5Ga alloy in 3.5% NaCl solution",Journal of The Electrochemical Society; Journal of The Electrochemical Societyvol : 153, no : , pp : B319- B324(SCI2006)[link]
  53. Mohanty, US;Lin, KL,"Effect of Al on the electrochemical corrosion behaviour of Pb free Sn-8.5 Zn-0.5 Ag-XAl-0.5 Ga solder in 3.5% NaCl solution",Applied Surface Science; Applied Surface Sciencevol : 252, no : , pp : 5907- 5916(SCI 06 2006)[link]
  54. Chen, KI;Cheng, SC;Wu, S;Lin, KL,"Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn-9Zn eutectic alloy",Journal of Alloys and Compounds; Journal of Alloys and Compoundsvol : 416, no : , pp : 98- 105(SCI 06 2006)[link]
  55. Liu, NS;Lin, KL,"The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu",Scripta Materialia; Scripta Materialiavol : 54, no : , pp : 219- 224(SCI 01 2006)[link]
  56. Mohanty, US;Lin, KL,"The effect of alloying element gallium on the polarization characteristics of Pb-free Sn-Zn-Ag-Al-XGa solders in NaCl solution",Corrosion Science; Corrosion Sciencevol : 48, no : , pp : 662- 678(SCI 03 2006)[link]
  57. Yu, CH;Lin, KL,"The atomic-scale studies of the behavior of the crystal dissolution in a molten metal",Chemical Physics Letters; Chemical Physics Lettersvol : 418, no : , pp : 433- 436(SCI 02 2006)[link]
  58. Liu, NS;Lin, KL,"Microstructure and mechanical properties of low Ga content Sn-8.55Zn-0.5Ag-0.1Al-xGa solders",Scripta Materialia; Scripta Materialiavol : 52, no : , pp : 369- 374(SCI 03 2005)[link]
  59. Cheng, SC;Lin, KL,"Microstructure and mechanical properties of Sn-8.55Zn-1Ag-XAl solder alloys",Materials Trans – JIM; Materials Trans – JIMvol : 46, no : , pp : 42- 47(SCI 01 2005)[link]
  60. Yu, CH;Lin, KL,"Early stage soldering reaction and interfacial microstructure formed between molten Sn-Zn-Ag solder and Cu substrate",J. Materials Research; J. Materials Researchvol : 20, no : , pp : 1242- 1249(SCI 05 2005)[link]
  61. Hsu, JC;Lin, KL,"The effect of saccharin addition on the mechanical properties and fracture behavior of electroless Ni-Cu-P deposit on Al",Thin Solid Films; Thin Solid Filmsvol : 471, no : , pp : 186- 193(SCI 01 2005)[link]
  62. Yu, CH;Lin, KL,"Early dissolution behavior of copper in a molten Sn-Zn-Ag solder",J. Materials Research; J. Materials Researchvol : 20, no : , pp : 666- 671(SCI 03 2005)[link]
  63. Mohanty, US;Lin, KL,"Electrochemical corrosion behaviour of lead-free Sn-8.5 Zn-X Ag-0.1 Al-0.5 Ga solder in 3.5% NaCl solution",Material Science and Engineering A; Material Science and Engineering Avol : 406, no : , pp : 34- 42(SCI 10 2005)[link]
  64. Shih, PC;Lin, KL,"Interfacial bonding behavior with introduction of Sn-Zn-Bi paste to Sn-Ag-Cu ball grid array package during multiple reflows",J. Materials Research; J. Materials Researchvol : 20, no : , pp : 219- 229(SCI 01 2005)[link]
  65. Liu, YH;Lin, KL,"Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration",J. Materials Research; J. Materials Researchvol : 20, no : , pp : 2184- 2193(SCI 08 2005)[link]
  66. Song, JM;Liu, PC;Shih, CL;Lin, KL,"Role of ag in the formation of interfacial intermetallic phases in Sn-Zn soldering",J. Electronic Materials; J. Electronic Materialsvol : 34, no : , pp : 1249- 1254(SCI 09 2005)[link]
  67. Shih, PC;Lin, KL,"Effect of microstructural evolution on electrical property of the Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste",J. Materials Research; J. Materials Researchvol : 20, no : , pp : 2854- 2865(SCI 10 2005)[link]
  68. Chuang, CM;Hung, HT;Liu, PC;Lin, KL,"The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 33, no : , pp : 7- 13(SCI 01 2004)[link]
  69. Chuang, CM;Shih, PC;Lin, KL,"Mechanical strength of Sn-3.5Ag-based solders and related bondings",J. Electronic Materials; J. Electronic Materialsvol : 33, no : , pp : 1- 6(SCI 01 2004)[link]
  70. Liu, YH;Chuang, CM;Lin, KL,"Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 19, no : , pp : 2471- 2477(SCI 08 2004)[link]
  71. Song, JM;Lin, KL,"Double peritectic behavior of Ag-Zn intermetallics in Sn-Zn-Ag solder alloys",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 19, no : , pp : 2719- 2724(SCI 09 2004)[link]
  72. Huang, CW;Lin, KL,"Wetting properties of and interfacial reactions in lead-free Sn-Zn based solders on Cu and Cu plated with an electroless Ni-P/Au layer",MATERIALS TRANSACTIONS; MATERIALS TRANSACTIONSvol : 45, no : , pp : 588- 594(SCI 02 2004)[link]
  73. Song, JM;Liu, NS;Lin, KL,"Microstructures, thermal and tensile properties of Sn-Zn-Ga alloys",MATERIALS TRANSACTIONS; MATERIALS TRANSACTIONSvol : 45, no : , pp : 776- 782(SCI 03 2004)[link]
  74. Huang, CW;Lin, KL,"Interfacial reactions of lead-free Sn-Zn based solders on Cu and Cu plated electroless Ni-P/Au layer under aging at 150 degrees C",Journal of Materials Research; Journal of Materials Researchvol : 19, no : , pp : 3560- 3568(SCI 12 2004)[link]
  75. Lin, CT;Lin, KL,"Effects of current density and deposition time on electrical resistivity of electroplated Cu layers",JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS; JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSvol : 15, no : , pp : 757- 762(SCI 11 2004)[link]
  76. Lin, KL;Wu, CH,"Structural evolution of electroless nickel bump",J. Electrochemical Society; J. Electrochemical Societyvol : 150, no : , pp : C273- C276(SCI 05 2003)[link]
  77. Lin, CT;Lin, KL,"Contact angle of 63Sn-37Pb and Pb-free solder on Cu plating",Applied Surface Science; Applied Surface Sciencevol : 214, no : , pp : 243- 258(SCI 05 2003)[link]
  78. Huang, CW;Lin, KL,"Microstructures and mechanical properties of Sn-8.55Zn-0.45A1-XAg solders",J. Materials Research; J. Materials Researchvol : 18, no : , pp : 1528- 1534(SCI 07 2003)[link]
  79. Lin, KL;Liu, YH,"The cathode current efficiency of flip-chip solder bump plating",J. Electrochemical Society; J. Electrochemical Societyvol : 150, no : , pp : C529- C532(SCI 08 2003)[link]
  80. Cheng, SC;Lin, KL,"Interfacial evolution between Cu and Pb-free Sn-Zn-Ag-Al solders upon aging at 150 degrees C",J. Materials Research; J. Materials Researchvol : 18, no : , pp : 1795- 1803(SCI 08 2003)[link]
  81. Hsu, JC;Lin, KL,"Enhancement in the deposition behavior and deposit properties of electroless Ni-Cu-P",J. Electrochemical Society; J. Electrochemical Societyvol : 150, no : , pp : C653- C656(SCI 09 2003)[link]
  82. Lin, KL;Shih, CL,"Wetting interaction between Sn-Zn-Ag solders and Cu",J. Electronic Materials; J. Electronic Materialsvol : 32, no : , pp : 95- 100(SCI 02 2003)[link]
  83. Hsu, JC;Lin, KL,"Effect of internal stress on elemental diffusion and crystallization of electroless Ni-Cu-P deposit on Al",J. Materials Research; J. Materials Researchvol : 18, no : , pp : 2221- 2227(SCI 09 2003)[link]
  84. Song, JM;Lin, KL,"Behavior of intermetallics in liquid Sn-Zn-Ag solder alloys",J. Materials Research; J. Materials Researchvol : 18, no : , pp : 2060- 2067(SCI 09 2003)[link]
  85. Lin, KL;Sun, LM,"Electrodeposition of eutectic Sn-Zn alloy by pulse plating",J. Materials Research; J. Materials Researchvol : 18, no : , pp : 2203- 2207(SCI 09 2003)[link]
  86. Chuang, CM;Lin, KL,"Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate",J. Electronic Materials; J. Electronic Materialsvol : 32, no : , pp : 1426- 1431(SCI 12 2003)[link]
  87. Lin, KL;Chen, KI;Shi, PC,"A potential drop-in replacement for eutectic Sn-Pb solder - The Sn-Zn-Ag-Al-Ga solder",J. Electronic Materials; J. Electronic Materialsvol : 32, no : , pp : 1490- 1495(SCI 12 2003)[link]
  88. Lin, CT;Lin, KL,"Preparation of Cu1-xTax films and the material interaction in the Si/Cu1-xTax/Cu structure",Materials Chemistry and Physics; Materials Chemistry and Physicsvol : 82, no : , pp : 306- 315(SCI 11 2003)[link]
  89. Chen, KI;Lin, KL,"The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys - The effect of Ga",J. Electronic Materials; J. Electronic Materialsvol : 32, no : , pp : 1111- 1116(SCI 10 2003)[link]
  90. Lin, KL;Shih, CL,"Microstructure and thermal behavior of Sn-Zn-Ag solders",J. Electronic Materials; J. Electronic Materialsvol : 32, no : , pp : 1496- 1500(SCI 12 2003)[link]
  91. Cheng, SC;Lin, KL,"The thermal property of lead-free Sn-8.55Zn-1Ag-XAI solder alloys and their wetting interaction with Cu",J. Electronic Materials; J. Electronic Materialsvol : 31, no : , pp : 940- 945(SCI 09 2002)[link]
  92. Lin, KL;Hwang, JW,"Effect of crystallinity and thickness on the diffusion barrier behavior of electroless nickel deposit between Cu and solder",IEEE Trans. On Advanced Packaging; IEEE Trans. On Advanced Packagingvol : 25, no : , pp : 509- 513(SCI 11 2002)[link]
  93. Lin, KL;Hwang, JW,"Effect of thiourea and lead acetate on the deposition of electroless nickel",Materials Chemistry and Physics; Materials Chemistry and Physicsvol : 76, no : , pp : 204- 211(SCI 08 2002)[link]
  94. Chen, KI;Lin, KL,"The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys - the effect of Ag",J. Electronic Materials; J. Electronic Materialsvol : 31, no : , pp : 861- 867(SCI 08 2002)[link]
  95. Lin, KL;Hsiao, CC;Chen, KI,"Microstructural evolution of Sn-Ag-Cu-Al solder with respect to Al content and heat treatment",J. Materials Research; J. Materials Researchvol : 17, no : , pp : 2386- 2393(SCI 09 2002)[link]
  96. Lin, KL;Chang, YL;Huang, CC;Li, FI;Hsu, JC,"Microstructure evolution of electroless Ni-P and Ni-Cu-P deposits on Cu in the presence of additives",Applied Surface Science; Applied Surface Sciencevol : 181, no : , pp : 166- 172(SCI 09 2001)[link]
  97. Chen, CJ;Lin, KL,"Electroless Ni-Cu-P barrier between Si/Ti/Al pad and Sn-Pb flip-chip solder bumps",IEEE Trans. On Component and Packaging Technology; IEEE Trans. On Component and Packaging Technologyvol : 24, no : , pp : 691- 697(SCI 12 2001)[link]
  98. Lin, KL;Hsu, HM,"Sn-Zn-AlPb-free solder - An inherent barrier solder for Cu contact",J. Electronic Materials; J. Electronic Materialsvol : 30, no : , pp : 1068- 1072(SCI 09 2001)[link]
  99. Chen, CJ;Lin, KL,"The reactions between electroless Ni-Cu-P deposit and 63Sn-37Pb flip chip solder bumps during reflow",J. Electronic Materials; J. Electronic Materialsvol : 29, no : , pp : 1007- 1014(SCI 08 2000)[link]
  100. Lin, KL;Chen, CL,"Intermittent electroless nickel deposition in a fine trench flip chip bump pad",J. Electrochemical Society; J. Electrochemical Societyvol : 147, no : , pp : 2604- 2606(SCI 07 2000)[link]
  101. Chen, CJ;Lin, KL,"Internal stress and adhesion of amorphous Ni-Cu-P alloy on aluminum",Thin Solid Films; Thin Solid Filmsvol : 370, no : , pp : 106- 113(SCI 07 2000)[link]
  102. Lin, KL;Hsu, KT,"Electrodeposition behaviors of solder bumps from fluoroborate & sulfonate baths",Plating & Surface Finishing; Plating & Surface Finishingvol : 87, no : , pp : 86- 89(SCI 03 2000)[link]
  103. Lin, KL;Hsu, KT,"Manufacturing and materials properties of Ti/Cu/Electroless Ni/Solder bump on Si",IEEE Trans. Component and Packaging Technology; IEEE Trans. Component and Packaging Technologyvol : 23, no : , pp : 657- 660(SCI 12 2000)[link]
  104. Lin, KL;Yao, S,"Solder thickness variation with respect to soldering parameters",IEEE Trans. Component and Packaging Technology; IEEE Trans. Component and Packaging Technologyvol : 23, no : , pp : 661- 664(SCI 12 2000)[link]
  105. Lin, KL;Chen, JW,"Wave soldering bumping process incorporating electroless nickel UBM",IEEE Trans. Component and Packaging Technology; IEEE Trans. Component and Packaging Technologyvol : 23, no : , pp : 143- 150(SCI 03 2000)[link]
  106. Lin KL;Liu YC,"Reflow and property of Al/Cu/electroless nickel/Sn-Pb solder bumps",IEEE TRANSACTIONS ON ADVANCED PACKAGING; IEEE TRANSACTIONS ON ADVANCED PACKAGINGvol : 22, no : 4, pp : 568- 574(SCI 11 1999)[link]
  107. Lin KL;Liu YC,"Manufacturing of Cu/electroless nickel/Sn-Pb flip chip solder bumps",IEEE TRANSACTIONS ON ADVANCED PACKAGING; IEEE TRANSACTIONS ON ADVANCED PACKAGINGvol : 22, no : 4, pp : 575- 579(SCI 11 1999)[link]
  108. Chen CJ;Lin KL,"The deposition and crystallization behaviors of electroless Ni-Cu-P deposits",JOURNAL OF THE ELECTROCHEMICAL SOCIETY; JOURNAL OF THE ELECTROCHEMICAL SOCIETYvol : 146, no : 1, pp : 137- 140(SCI 01 1999)[link]
  109. Lin KL;Liu YT,"Manufacturing of solder bumps with Cu/Ta/Cu as under bump metallurgy",IEEE TRANSACTIONS ON ADVANCED PACKAGING; IEEE TRANSACTIONS ON ADVANCED PACKAGINGvol : 22, no : 4, pp : 580- 585(SCI 11 1999)[link]
  110. Lin KL;Liu TP,"The electrochemical corrosion behaviour of Pb-free Al-Zn-Sn solders in NaCl solution",MATERIALS CHEMISTRY AND PHYSICS; MATERIALS CHEMISTRY AND PHYSICSvol : 56, no : 2, pp : 171- 176(SCI 10 1998)[link]
  111. Lin KL;Liu TP,"High-temperature oxidation of a Sn-Zn-Al solder",OXIDATION OF METALS; OXIDATION OF METALSvol : 50, no : 3-4, pp : 255- 267(SCI 10 1998)[link]
  112. Lin KL;Chung FC;Liu TP,"The potentiodynamic polarization behavior of Pb-free XIn-9(5Al-Zn)-YSn solders",MATERIALS CHEMISTRY AND PHYSICS; MATERIALS CHEMISTRY AND PHYSICSvol : 53, no : 1, pp : 55- 59(SCI 04 1998)[link]
  113. Lin KL;Wen LH;Liu TP,"The microstructures of the Sn-Zn-Al solder alloys",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 27, no : 3, pp : 97- 105(SCI 03 1998)[link]
  114. Lin KL;Chao WH,"Material interactions of solder bumps produced with fluxless wave soldering",IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING; IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGINGvol : 21, no : 1, pp : 59- 64(SCI 02 1998)[link]
  115. Lin KL;Wang YC,"Wetting interaction of Pb-free Sn-Zn-Al solders on metal plated substrate",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 27, no : 11, pp : 1205- 1210(SCI 11 1998)[link]
  116. Lin KL;Wen LH,"The wetting of copper by Al Zn Sn solders",JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS; JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSvol : 9, no : 1, pp : 5- 8(SCI 02 1998)[link]
  117. Lin KL;Chue CH;Kou BC,"Deformation and corrosion of hot dip galvanized coatings",MATERIALS CHEMISTRY AND PHYSICS; MATERIALS CHEMISTRY AND PHYSICSvol : 50, no : 1, pp : 82- 87(SCI 08 1997)[link]
  118. Lee CY;Lin KL,"Preparation of solder bumps incorporating electroless nickel-boron deposit and investigation on the interfacial interaction behaviour and wetting kinetics",JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS; JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSvol : 8, no : 6, pp : 377- 383(SCI 12 1997)[link]
  119. Lin KL;Chen SK;Chang SY,"Adhesion of multilayer solder pads on silicon",JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS; JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSvol : 8, no : 4, pp : 253- 257(SCI 08 1997)[link]
  120. Chen CJ;Lin KL,"Wetting interactions between the Ni-Cu-P deposit and In-Sn solders",IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING; IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGINGvol : 20, no : 3, pp : 211- 216(SCI 08 1997)[link]
  121. Lin KL;Chao WH;Wu CD,"The performance and degradation behaviours of the TiAlN/interlayer coatings on drills",SURFACE & COATINGS TECHNOLOGY; SURFACE & COATINGS TECHNOLOGYvol : 89, no : 3, pp : 279- 284(SCI 03 1997)[link]
  122. Lin KL;Chen SK,"The interdiffusion and the feasibility of Al/Mo/Ni/(Pb-Sn) as a solder bump system",THIN SOLID FILMS; THIN SOLID FILMSvol : 295, no : 1-2, pp : 218- 223(SCI 02 1997)[link]
  123. Lin KL;Hwang MY;Wu CD,"The deposition and wear properties of cathodic arc plasma deposition TiAlN deposits",MATERIALS CHEMISTRY AND PHYSICS; MATERIALS CHEMISTRY AND PHYSICSvol : 46, no : 1, pp : 77- 83(SCI 10 1996)[link]
  124. Lin KL;Chang SY,"The morphologies and the chemical states of the multiple zincating deposits on Al pads of Si chips",THIN SOLID FILMS; THIN SOLID FILMSvol : 288, no : 1-2, pp : 36- 40(SCI 11 1996)[link]
  125. Lin KL;Chang SY,"Approaching a uniform bump height of the electroplated solder bumps on a silicon wafer",IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING; IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGINGvol : 19, no : 4, pp : 747- 751(SCI 11 1996)[link]
  126. Lin KL;Chang SY,"The morphologies and compositions of electroplated solder bumps on a silicon wafer",PLATING AND SURFACE FINISHING; PLATING AND SURFACE FINISHINGvol : 83, no : 6, pp : 58- 61(SCI 06 1996)[link]
  127. Lin KL;Chen CJ,"The interactions between In-Sn solders and an electroless Ni-P deposit upon heat treatment",JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS; JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSvol : 7, no : 6, pp : 397- 401(SCI 12 1996)[link]
  128. HO JK;LIN KL,"PREPARATION OF AL-NI ALLOY-FILMS BY ALTERNATE SPUTTER-DEPOSITION",JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS; JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMSvol : 13, no : 4, pp : 2170- 2176(SCI 07 1995)[link]
  129. LIN KL;CHANG JT,"THE COMPOSITION AND MICROSTRUCTURE OF ELECTRODEPOSITED SOLDER ON ELECTROLESS NICKEL IN THE PRESENCE OF GELATIN",JOURNAL OF MATERIALS SCIENCE; JOURNAL OF MATERIALS SCIENCEvol : 30, no : 7, pp : 1879- 1883(SCI 04 1995)[link]
  130. LIN KL;LEE CY;HWANG MY,"WETTING OF METALS WITH CAST-IRON AND 304-STAINLESS-STEEL",JOURNAL OF MATERIALS SCIENCE LETTERS; JOURNAL OF MATERIALS SCIENCE LETTERSvol : 14, no : 18, pp : 1314- 1316(SCI 09 1995)

研討會論文

  1. Fu-Jung Yeh*;Tsung-Chieh Chiu;Kwang-Lung Lin,"The Electrical Characteristics and Interfacial Interaction of Ti/Ni/Ag/Au Multilayers under Thermal Cycling Test",Symposium on Pb-Free Solders and Other Materials for Emerging Interconnect and Packaging Technologies, TMS Annual Meeting 2012;( 03 2012)[link]
  2. Yu-Wei Lin*;Kwang-Lung Lin,"The Initial Reflow Interaction between Sn3.0Ag0.5Cu Solder and Ni Metallization",Symposium on Pb-Free Solders and Other Materials for Emerging Interconnect and Packaging Technologies, TMS Annual Meeting 2012;( 03 2012)[link]
  3. Wei-Yu Chen*;Kwang-Lung Lin,"Effect of Thermomigration on Redistribution and Growth of Intermetallic Compounds in the Sn0.7Cu Solder Bump under Current Stressing",Symposium on Pb-Free Solders and Other Materials for Emerging Interconnect and Packaging Technologies, TMS Annual Meeting 2012;( 03 2012)[link]
  4. Chang-Ho Yu;Chien-Cheng Pan;Yu-Wei Lin;Kwang-Lung Lin,"Nucleation of Interfacial IMC Formed between Solder and Metal Substrate",IUMRS-ICA 2011 暨100年中國材料科學學會;(2011)[link]
  5. W. J. Deng;K. L. Lin;Y. T. Chiu;Y. S. Lai,"Electromigration-Induced Accelerated Consumption of Cu Pad in Flip Chip Sn2.6Ag Solder Joints",ECTC 2011 – The 61st Electronic Component and Technology Conference;(2011)[link]
  6. Ying-Ta Chiu;Shi-Min Kuo;Chia-Hao Liu;Kwang-Lung Lin;Yi-Shao Lai,"Supersaturation and Recrystallization in Solder Alloys Induced by Current Stressing",TMS Annual Meeting;(2011)[link]
  7. Tsung-Chieh Chiu;Kwang-Lung Lin,"Interfacial reactions of Cu/Sn3.5Ag/Au solder joint under electromigration",TMS Annual Meeting;(2010)[link]
  8. 劉家豪;林光隆,"電遷移對高鉛銲錫合金微觀組織的影響",2010年中國材料科學學會年會;(2010)[link]
  9. Ying-Ta Chiu;Kwang-Lung Lin,"The Enhanced Growth of Sn Whisker on High Melting Temperature Sn-Pb Solder Joint by Current Stressing",TMS Annual Meeting;(2010)[link]
  10. Ying-Ta Chiu;Shi-Min Kuo;Kwang-Lung Lin,"The Nanostructure in a Metal Alloy Triggered by Electrical Current Stressing",ISMEN 2010 – International Symposium on Materials Enabling Nanodevice;(2010)[link]
  11. 林宸禕;林光隆,"Sn-8.5Zn-0.1Ag-0.01Al-0.1Ga合金銲錫迴焊條件之設計與研究",2010年中國材料科學學會年會;(2010)[link]
  12. 謝佩珊;林光隆,"錫銀合金與無電鍍鎳固液界面反應之研究",2010年中國材料科學學會年會;(2010)[link]
  13. 郭窈伶;林光隆,"錫鋅共晶銲錫與電鍍鎳層之界面反應研究",2010年中國材料科學學會年會;(2010)[link]
  14. 周忠毅;林光隆,"電遷移效應對共晶錫鋅銲錫線材機械性質之影響",2009年中國材料科學學會年會;(2009)[link]
  15. 林奕安;林光隆,"Synthesis and characteristics of Zn-based alloys for high temperature solder application(鋅基高溫無鉛銲錫合金開發及其性質之研究)",2009年中國材料科學學會年會;(2009)[link]
  16. ,"電遷移效應對錫鋅五元銲錫合",2009年中國材料科學學會年會;(2009)[link]
  17. Teng-Chun Hsuan;Kwang-Lung Lin,"Effect of Strain rate and Temperature on Tensile properties of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga Solder",TMS Annual Meeting;(2009)[link]
  18. Ya Ling Huang;Kwang Lung Lin;D. S. Liu,"The Performance and Fracture Behavior of Low Silver Lead-free Solder Joints upon Micro-Impact Test",TMS Annual Meeting;(2009)[link]
  19. Jagjiwan Mittal;Shih-Ming Kuo;Yu-Wei Lin;Kwang-Lung Lin,"Diffusion behaviour of Zn during reflow of Sn-9Zn Solder on Ni/Cu substrate",TMS Annual Meeting;(2009)[link]
  20. Chiu-Wen Lee;Shih-Ming Kuo;Kwang-Lung Lin,"Interfacial Behavior between Copper Foil and Tin upon Thermal Aging",Joint Conference: The 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, The 10th International Conference on Electronics Materials and Packaging;(2008)[link]
  21. T. S. Wang;S. C. Liu;Y. L. Huang;K. L. Lin;Y.S. Lai,"The Microstructure and Fracture Behavior of Sn-3Ag-0.5Cu Solder Joints",Joint Conference: The 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, The 10th International Conference on Electronics Materials and Packaging;(2008)[link]
  22. 王泰翔;林光隆,"銲錫接點於高速衝擊測試下之破壞行為及機制之研究",ASE Technology Journal;(2008)[link]
  23. 賴彥棻;林光隆,"錫鋅銀鋁鎵無鉛銲錫之摔落可靠",ASE Technology Journal;(2008)[link]
  24. 劉士齊;林光隆,"銲錫接點於高速剪切測試下之可靠度及破壞行為與機制分析",二○○八年中國材料科學學會年會;(2008)[link]
  25. Ya-Ling HUANG;Kwang-Lung LIN;De-Shin LIU,"Effect of Impact Rate on the Strength of Lead-free Solder Joints",EPTC 2008;(2008)[link]
  26. 王泰翔,"銲錫接點於高速衝擊測試下之破壞",二○○八年中國材料科學學會年會;(2008)[link]
  27. Y. L. Huang;K. L. Lin;D. S. Liu,"Microimpact Test and the Fracture Behavior of Pb-free Solder Joints",MRS International Materials Research Conference (IMRC2008) Symposium C: Electronic Packaging Materials;(2008)[link]
  28. R.S. Lai;K.L. Lin;B. Salam,"Suppressing the Growth of Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints",TMS Annual Meeting;(2008)[link]
  29. Yen-Fen Lai;Kwang-Lung Lin;Yi-Shao Lai,"Drop Test Reliability and Solder Joint Failure Modes of Sn-Zn-Ag-Al-Ga Lead-Free Solder",MRS International Materials Research Conference (IMRC2008) Symposium C: Electronic Packaging Materials;(2008)[link]
  30. Kwang-Lung Lin;Ger-Pin Lin,"The Electromigration Investigation on the Newly Developed Pb-free Sn-Zn-Ag-Al-Ga Solder Ball Interconnect",Electronic Components and Technology Conference 2007;( 05 2007)[link]
  31. Kwang-Lung Lin;Chang-Ho Yu,"Homogeneous Nucleation of Intermetallic Compounds Formed between Cu and Solders during Soldering",Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials VI, TMS Annual Meeting;( 02 2007)[link]
  32. Kwang-Lung Lin,"Interfacial Evolution between Solder and Metallization",State of Art Lead-free Technology Workshop, TMS Annual Meeting;( 02 2007)[link]
  33. Chia-Wei Huang;Kwang-Lung Lin,"Morphology of Intermetallic Compounds formed between Lead-free Sn-Zn Based Solders and Cu Substrate",TMS 2006 Annual Meeting “Lead Free Solder Implementation: Reliability, Alloy Development, and New Technology;( 03 2006)[link]
  34. 白冠智;林光隆,"錫-鋅共晶無鉛銲錫球柵式陣列構裝之電遷移研究",中國材料科學學會95年年會;(2006)[link]
  35. Kwang-Lung Lin,"Properties and Applications of Lead-free Solder",2006 International Conference on Nanotechnology and Advanced Materials;( 11 2006)[link]
  36. Kwang-Lung Lin;Shih-Ming Kuo,"The Electromigration and Thermomigration Behaviors of Pb-FreeFlip Chip Sn-3Ag-0.5Cu Solder Bumps",Proceedings - Electronic Components and Technology Conference 2006;( 05 2006)[link]
  37. Lin, K.-L.;Chiu, Y.-T.,"The bonding of Sn-Zn-Ag-Al-Ga lead-free solder balls on Cu/Ni-P/Au BGA substrate",Proceedings - Electronic Components and Technology Conference;(2005)[link]
  38. Kwang-Lung Lin;Yen-Hsiang Fang,"Electromigration of Sn-9Zn Solder in Contact with Cu",9th International Symposium on Advanced Packaging Materials - Processes, Properties and Interface;( 03 2005)[link]
  39. Kwang-Lung Lin;Po-Yi Yeh;Jenn-Ming Song,"Dissolution Behavior and Interfacial Morphology of Cu and Ag in Reacting with Molten Lead-Free Solders",TMS Fall Meeting 2004;( 09 2004)[link]
  40. J. M. Song;P. C. Liu;K. L. Lin,"Wettability and Properties of Sn-Zn-Ga Solders",TMS Annual Meeting;( 03 2004)[link]
  41. Kwang-Lung Lin;Po-Cheng Shih,"IMC Formation on BGA Package with Sn-Ag-Cu and Sn-Ag-Cu-Ni-Ge Solder Balls",TMS Annual 2004;( 03 2004)[link]
  42. Kwang Lung Lin;Pei Chi Liu;Jenn Ming Song,"Wetting Interaction between Pb-free Sn-Zn Series Solders and Cu, Ag Substrates",54th ECTC 2004 – IEEE CPMT;( 06 2004)[link]
  43. Kwang-Lung Lin;Chia-Ling Shih,"Microstructure and Thermal Behavior of Sn-Zn-Ag Solders",TMS Annual 2003;( 03 2003)[link]
  44. Jenn-Ming Song;Po-Yi Yeh;Kwang-Lung Lin,"Dissolution of Cu and Ag by molten lead-free solders",EMAPS 2003;( 11 2003)[link]
  45. Kwang-Lung Lin;Kang-I Chen;Hui-Min Hsu;Chia-Ling Shi,"Improvement in the Properties of Sn-Zn Eutectic Based Pb-free Solder",ECTC 2003-IEEE CPMT;( 05 2003)[link]
  46. Kwang-Lung Lin;Kang-I Chen;Po-Cheng Shi,"A Potential Drop-in-Replacement for Eutectic Sn-Pb Solder – the Sn-Zn-Ag-Al-Ga Solder",TMS Annual 2003;( 03 2003)[link]
  47. K. I. Chen;K. L. Lin,"Effect of Gallium on Wettability, Microstructures and Mechanical Properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga Solder Alloys",EMAPS 2002;( 12 2002)[link]
  48. 施嘉玲;林光隆,"錫鋅銀無鉛銲錫與銅基材之潤濕行為",中國材料科學學會91年年會;(2002)[link]
  49. 孫立明;林光隆,"電鍍錫鋅合金及其鍍層之性質研究",中國材料科學學會91年年會;(2002)[link]
  50. 吳志豪;林光隆,"覆晶接合無電鍍鎳底層金屬成長之控制",中國材料科學學會91年年會;(2002)[link]
  51. Chiang-Ming Chuang;Po-Cheng Shi;Kwang-Lung Lin,"Interfacial Reaction between Sn-Ag-Cu, Sn-Ag-Cu-Ni-Ge Lead-free Solders and Metallic Substrates",EMAPS 2002;( 12 2002)[link]
  52. 鄭壽昌;林光隆,"Sn-8.55Zn-1Ag-XAl無鉛銲錫合金與銅線的潤濕行為",中國材料科學學會91年年會;(2002)[link]
  53. 鄭壽昌;林光隆,"不同助熔劑對錫鋅銀鋁無鉛銲錫合金的潤濕性質之影響",中國材料科學學會91年年會;(2002)[link]
  54. K. L. Lin,"Variation of Melting Temperature Upon Particle Size Reduction",Symposium on Phase Stability, Phase Transformation and Reactive Phase Formation in Electronic Materials, TMS Annual Meeting;( 02 2002)[link]
  55. K. L. Lin;M. T. Tsai;C.H.Wu,"Mechanical Strength of Hot Dip Galvanized Rebar",5th Asian-Pacific General Galvanizing Conference;( 10 2001)[link]
  56. 尤志豪;林光隆,"以聚亞醯胺為鈍化層之銲錫隆點的可靠性研究",中國材料科學學會90年年會;(2001)[link]
  57. H. Iksan;K. L. Lin;J. Hsieh,"Frature Analysis on Die Crack Failure",IMAPs Taiwan Technical Symposium 2001;( 04 2001)[link]
  58. K. L. Lin;H. M. Hsu,"Sn-Zn-Al Pb-free Solder - an Inherent Barrier Solder for Cu Contact",Lead-Free Solder Materials and Soldering Technologies Symposium, 2001 TMS Annual Meeting;( 02 2001)[link]
  59. K. I. Chen;K. L. Lin,"The Microstructure and Mechanical Properties of the Sn-Zn-Ag-Al-Ga Solder Alloys",IMAPs Taiwan Technical Symposium 2001;( 04 2001)[link]
  60. K. L. Lin;H. M. Hsu,"Materials Interaction Between Inherent Barrier Pb-free Sn-Zn-Al Solder and Cu Contact",EMAP2000, International Symposium on Electronic Materials and Packaging;( 11 2000)[link]
  61. K. L. Lin;W. L. Chen;J. C. Ho;H. K. Chow;C. T. Tu,"The Evaluation of Sn-Ag and Sn-Ag-Cu Solder for BGA Application",Advanced Electronics Assembly - A Symposium on Pb-Free Interconnect;( 06 2000)[link]
  62. C. J. Chen;K. L. Lin,"Fabrication and Adhesion of Low Stress Electroless Ni-Cu-P Bump on Copper Pad",Proc. 50th Electronic Components and Technology Conference;( 05 2000)[link]
  63. K. L. Lin;C. H. You;S. P. Hu,"Optical Properties of Al Film Deposited on Polymer",14th International Conference on Surface Modification Technologies;( 09 2000)[link]
  64. 陳偉亮;林光隆,"覆晶接合導電膠至程與性質之研究",中國材料科學學會89年年會;(2000)[link]
  65. 黃家緯;林光隆,"析鍍條件對銲錫隆點底層金屬無電鍍鎳成長與擴散障礙層性質之影響",中國材料科學學會89年年會;(2000)[link]
  66. 鍾明錦;林光隆,"以錫膏印製Ta/CuTa/Cu/Ni/Au/Solder銲錫隆點及其可靠度之研究",中國材料科學學會90年年會;(2000)[link]
  67. K. L. Lin;C. J. Chen,"Manufacturing and Interfacial Reaction of Si/Ti/Al/Ni-Cu-P/95Pb-5Sn Flip Chip Solder Bump",IMAPS Taiwan Technical Symposium 2000;( 04 2000)[link]
  68. C. J. Chen;K. L. Lin,"Structure and Crystallization of Electroless Ni-Cu-P Alloys",Oesterreichische Chemietage;( 09 2000)[link]
  69. 許惠閩;林光隆,"錫鋅鋁銲錫隆點之浸鍍條件及其性質之研究",中國材料科學學會89年年會;(2000)[link]
  70. K. L. Lin;Y. C. Liu,"Shearing Strength and Materials Interaction During Reflow of Al/Cu/Electroless Nickel/Solder Bump",Proc. 49th Electronic Components and Technology Conference;( 06 1999)[link]
  71. K. L. Lin;Jessica Sue,"Effect of Passivation Height on the Deposition of Solder Bump",4th R.O.C./Austria Workshop on Ceramic and Metal Structural Composites;( 03 1999)[link]
  72. K. L. Lin;F. C. Chung;L. C. Chen;R. Hsiao,"The Development of Fumeless Flux for Galvanizing",4th Asia Pacific General Galvanizing Conference;( 09 1999)[link]
  73. K. L. Lin;H. R. Tsai,"The Effect of Pad Dimension on Growth of Flip Chip Electroless Nickel/Electroplated Solder Bump",13th Surface Modification Technology Conference;( 09 1999)[link]
  74. Y. C. Liu;K. L. Lin,"The Interaction Among Solder/Nickel/Copper/Aluminum Bump Structure During Reflow",International Symposium on Advanced IC Packaging Technology;( 04 1998)[link]
  75. 林建泰;林光隆,"Si/Ta/Cu UBM 鍍層之結合強度",中國材料學會年會;(1998)[link]
  76. K. L. Lin;Y. C. Liu,"Flux Effect on Reflow of Flip Chip Solder Bump",1998 International Electron Devices and Materials Symposia;( 12 1998)[link]
  77. K. L. Lin;Y. T. Liu,"Sputtering Deposition of Aluminum Nitride on Silicon",SURFACE MODIFICATION TECHNOLOGIES XI, T. S. Sudarshan, M. Jeandin, and K. A. Khor eds., (Proc.11th International Conference on Surface Modification Technologies, Paris, France, Sept. 8-10, 1997), ASM International, Materials Park;(1998)[link]
  78. 陳智禮;林光隆,"矽晶片以真空蒸鍍法沈積銲錫隆點之金屬鍍層性質",中國材料學會年會;(1998)[link]
  79. 林光隆,"電子構裝覆晶接合銲錫隆點材料及製程",中國材料學會年會;(1998)[link]
  80. 許坤賜;林光隆,"無電鍍鎳/銲錫隆點之製程與反應",中國材料學會年會;(1998)[link]
  81. 黃超群;林光隆,"鋅置換對矽晶片鋁磨無電鍍鎳析鍍之影響",中國材料學會年會;(1998)[link]
  82. K. L. Lin;F. C. Chung;T. P. Liu,"The Electrochemical Behavior of In-Al-Zn-Sn Pb-free Solder",The 10th Asia Pacific Corrosion Control Conference;( 10 1997)[link]
  83. K. L. Lin;S. Y. Chang,"Reflow Effect on the Interfacial Behaviours of the Electroplated Solder Bumps",1996 International Electron Devices and Materials Symposia;( 12 1996)[link]
  84. K.L. Lin;Y. C. Ho,"The Interactions in the Composite Al/Mo-N/Au Multilayer",Sino-South-Africa Symposium on Composite Materials Systems;( 03 1996)[link]
  85. 劉子平;林光隆,"無鉛焊錫材料9(5Al-Zn)-Sn的耐蝕性測試",中華民國防蝕工程學會年會;(1996)[link]
  86. 陳俊仁;林光隆,"無電鍍鎳銅磷與銦錫焊錫之固相界面反應",中國材料學會年會;(1996)[link]
  87. 林光隆;李森墉;褚晴暉;郭明倫;郭博欽,"撞傷對熱浸鍍鋅鋼板耐蝕力之影響",中華民國防蝕工程學會年會;(1995)[link]
  88. C. Y. Lee;K. L. Lin,"Bonding Fracture Mechanism Between Sn-Pb Solder and Electroless Nickel-alloy Deposits",Advances in Electronic Packaging 1995 - Proc.InterPack'95;( 03 1995)[link]
  89. 李傳英;林光隆,"以Wetting Balance 技術探討無電鍍鎳的焊錫性",中國材料學會年會;(1994)[link]
  90. K. L. Lin;J. K. Ho,"The Corrosion Behaviors of Hot Dip Zinc Coatings and Steel Under a Controlled Environment",Proc. The 2nd Asian-Pacific General Galvanizing Conf.;( 10 1994)[link]
  91. 李傳英;林光隆,"無電鍍鎳硼和熔融鉛錫合金間的潤濕動力與化合物生成研究",中國材料學會年會;(1994)[link]
  92. K. L. Lin;J. K. Ho;C. S. Jong;J. T. Lee,"The Formation of Intermetallics and Its Effect on the Microstructure of the Hot Dip 5%Al-Zn Coatings on Steel",THE PHYSICAL METALLURGY OF ZINCCOATED STEELS. Ed. A. R. Marder, TMS;( 02 1994)[link]
  93. Y. P. Lee;K. L. Lin;J. T. Lee,"Electrochemical and Corrosion Behavior of Iridium-Palladium Oxide Electrode Prepared by Electrochemical Methods",International Conf. on Advances in Corrosion and Protection;( 06 1992)[link]
  94. 林光隆;李汝桐;李傳英,"模擬蘭嶼貯存壕溝環境之桶材與鍍鋅層腐蝕速率",原子能委員會研究成果討論會;(1992)[link]
  95. J. K. Ho;K. L. Lin,"The Properation of Zr-Al Alloy Thin Films by Co-sputtering",中國材料科學學會;(1992)[link]
  96. K. L. Lin;J. T. Lee,"The Status of Hot Dip Galvanizing Industry in Taiwan",1st Asian-Pacific General Galvanizing Conf.;( 09 1992)[link]
  97. H. Y. Huang;K. L. Lin,"A Potential Market Prediction for the Batch Type Hot Dip Galvanizing in Taiwan",1st Asian- Pacific General Galvanizing Conf.;( 09 1992)[link]
  98. K. L. Lin;C. Y. Lee,"A Solder Bump Incorporated with Electroless Nickel Deposits",Surface Modification Technologies V, Proc. 6th International Conf. on Surface Modification Technology;( 11 1992)[link]
  99. C. Y. Lee;K. L. Lin,"Solder Bumps Incorporates Electroless Nickel Boron as a Diffusion Barrier",中國材料科學學會;(1992)[link]
  100. 鄭建銘;林光隆,"溫度和時間對焊錫和無電鍍鎳間之潤濕性的影響",中國材料科學學會;(1992)[link]
  101. K. L. Lin;Jeng-Chou Shu;Yi-Ming Shu;Jey-Ting Chang,"Electroplating Ni-Cr on Steel with Pulse Plating",Surface Modification Technologies IV, Proc. Fifth International Conference on Surface Modification Technologies;( 09 1991)[link]
  102. Y. P. Lee;K. L. Lin;J. T. Lee,"Cyclic Voltammetry Prepared Transition Metal Oxide",5th International Symp. on electrochemistry;( 10 1991)[link]
  103. 黃忠梅;林光隆,"鎳基超合金白金鋁化塗層探討",中國材料學會年會;(1991)[link]
  104. 鍾長祥;林光隆;李傳英,"氧化鋁陶瓷上無電鍍鎳的成長動力學",中國材料學會年會;(1991)[link]
  105. 林光隆;李汝桐;張介亭;何晉國;李淵博,"蘭嶼貯存場廢料桶使用壽命評估",原子能委員會研究成果討論會;(1991)[link]
  106. 何晉國;林光隆,"TheMicrostructureandCorrosion Resistanceof HotDipGalvanized and 5%Al-ZnCoatings on Steel",中國材料學會年會;(1991)[link]
  107. K. L. Lin;W. C. Liu;M. H. M. Lin;Y. W. Hu,"The Growth Behavior and Properties of DC and PC Gold Platings",SUR/FIN'91;( 06 1991)[link]
  108. J. K. Ho;K. L. Lin,"TheCrystallization ofAmorphous Cr-Ni-P Alloy Platings",中國材料學會年會;(1990)[link]
  109. 劉伍健;林光隆,"鍍液添加劑對黃金電鍍層組織的影響",中國材料學會年會;(1990)[link]
  110. K. L. Lin;W. C. Liu,"Properties of Dip Soldering in Combination with Electroless Plating on Aluminum",Southern Illinois University- Cheng Kung University Joint Conf.;(1990)[link]
  111. J. T. Lee;K. L. Lin,"Enhancement in the Life of the low Level Radwaste Barrel",Proc. ROC/ROK Joint Symposium on Radwaste Management;( 11 1990)[link]
  112. 林光隆;李汝桐;何晉國,;鍾長祥,"熱浸鍍鋁鋅層厚度與鍍層耐蝕力之關係研究",原子能委員會七十九年度研究成果討論會;(1990)[link]
  113. 林光隆,"廢液之重金屬的回收與轉化",資源再生及其污染防治技術研討會;(1990)[link]
  114. 林光隆,"逆滲透膜於重金屬廢液處理之研究",金屬再生及其污染防治技術研討會;(1989)[link]
  115. 劉伍健;林光隆,"黃金電鍍之實驗條件與電鍍層性質之關係",中國材料學會年會;(1989)[link]
  116. 王惠昌;林光隆,"水解參數對烷氧衍生氧化鋯熱行為之影響",中國材料學會年會;(1989)[link]
  117. 周全啟;林光隆;黃啟祥,"真空物理蒸鍍鋅於鋼板基板上之研究",中國材料學會年會;(1989)[link]
  118. K. L. Lin;P. J. Lai,"The Microstructural Variation and the Interdiffusion Phenomena of the Electroless Nickel Deposits Upon Heat Treatment",Surface Modification Technologies III, Proc Third International Conference on Surface Modification Technologies;( 08 1989)[link]
  119. K. L. Lin;Chun-Feng Yang,"The Electrochemical and Corrosion Behavior of the Hot Dip 5%Al-Zn Coating",Proc. CORROSION PACIFIC '89;( 09 1989)[link]
  120. 楊春風;林光隆;李汝桐,"熱浸鍍鋅鋁合金耐蝕機構之探討",中國材料學會年會;(1989)[link]
  121. 溫添進;魏明國;陳智琛;林光隆,"非溶性陽極鈦基氧化鉛之製作與鍍層研究",中國材料學會年會;(1989)[link]
  122. 何晉國;林光隆,"電鍍鎳鉻合金之電鍍條件與鍍層結構",中國材料學會年會;(1989)[link]
  123. C. S. Hwang;K. L. Lin;C. C. Joau,"An Investigation of Vacuum Deposition of Zinc on Steel Substrate",Proc. Sino- Japanese Symposium on Dry Processing for Functional Surface Modification;(1989)[link]
  124. 林光隆;李汝桐;楊春風,"低放射性待處理物料貯存鋼桶之鍍鋅層耐蝕性研究",原子能委員會七十七年度研究成果討論會;(1988)[link]
  125. T. H. Lin;K. L. Lin,"Preparation of Zirconia Powders by Hydrolysis of Alkoxide",1988 Ann. Conf. Chinese Soc. Mat. Sci.;(1988)[link]
  126. K. L. Lin;J. K. Ho,"The Corrosion and Passivation of the 55%Al-Zn Hot Dip Coating",Proc. CORROSION PACIFIC'87;(1987)[link]
  127. 林光隆;何晉國,"熱浸鍍 55% 鋁鋅鍍層的電化學行為",中國材料學會年會;(1987)[link]
  128. 黃文亮;林光隆;王惠昌,"水解程序對烷氧化物製備之粉末性質的影響",中國化學學會年會;(1987)[link]
  129. K. L. Lin;J. K. Ho,"The Passivation of 55%Al-Zn Hot Dip Coating",TMS Fall Meeting;( 10 1987)[link]
  130. K. L. Lin;P. C. Wang,"The Electroless Ni-P and Composit Al2O3-Ni-P Plating on Steel",Proc. 1986 Ann. Conf. Chinese Soc. Mat. Sci.;(1986)[link]
  131. K. L. Lin;K. S. Ten,"TheStability ability of stabili zers on Coprecipitated Zirconia Powders",Proc. 1986 Ann. Conf. Chinese Soc. Mat. Sci.;(1986)[link]
  132. K. L. Lin;P. C. Wang,"Aspects on the Processing Conditions for Electroless Nickel Plating and the Plating Morphology",Materials Week'86;( 10 1986)[link]
  133. K. L. Lin;J. K. Ho,"The Effect of Cooling Rate on the Performance of Hot Dip 55%Al-Zn Coating on Steel",Proc. 1986 Ann. Conf. Chinese Soc. Mat. Sci;(1986)[link]
  134. K. L. Lin;J. T. Lee,"The Recent Interfacial Studies in Hydrometallurgical Solvent Extraction",Hydrometallurgy Symposium;(1985)[link]
  135. M. L. Chu;K. L. Lin;C. P. Wang;M. C. Shieh,"A Study of Reverse Osmosis Membrane to Recover Uranium from Uranium Nitrate Effluent (UNE)",Chinese Chemical Society Annual Meeting;(1985)[link]
  136. K. L. Lin;D. C. Liu;R. Markuszewski;R. G. Bautista,"Chemical Desulfurization of Coal with Caro's Acid",2nd Annual Pittsburgh Coal Conference;( 09 1985)[link]
  137. K. Osseo-Asare;K. L. Lin;D. J. Chaiko;Y. Zheng,"Catalysis of Metal Extraction by HDNNS Micelles",58th Colloid and Surface Science Symposium;( 06 1984)[link]
  138. K. L. Lin;K. Osseo-Asare,"Electrophoretic Mobility Studies in Liquid-Liquid Extraction Systems",International Solvent Extraction Conference;( 08 1983)[link]
  139. K. Osseo-Asare;K. L. Lin;D. J. Chaiko,"Mass Transfer in Catalytic Systems: Micelles, Liquid Membranes and Single Drop Drops",International Solvent Extraction Conference;( 08 1983)[link]

專書著作

  1. Udit S. Mohanty;Kwang-Lung Lin,"Electrodeposition: Properties, Processes and Applications",[link]
  2. Udit S. Mohanty*;S. Y. Chen;Kwang-Lung Lin,"Smart Nanoparticles Technology",[link]
  3. Kwang-Lung Lin,"Electromigration in Thin Films and Electronic Devices:Materials and Reliability",[link]

Other Publications

  1. 林光隆,"”無鉛錫球之技術",[link]
  2. 林光隆;宋振銘;黃家緯,"”Sn-Zn 系無鉛銲錫合金與基材界面金屬間化合物生成之探討”, 界面科學會誌",[link]
  3. 黃家緯;林光隆,"”電子構裝無鉛銲錫的現況與發展”，銲皆與切割",[link]
  4. 林光隆;宋振銘,"”Sn-Zn系列無鉛銲錫合金研究現況” 材料會訊",[link]
  5. Kwang-Lung Lin,"“Recent Academic Research Progress in Materaisl in Taiwan,” IUMRS Facets",[link]
  6. 林光隆,"”鋼筋覆層防蝕方法探討”，土木工程技術",[link]
  7. 林建泰;林光隆,"”覆晶接合銲錫隆點之製程以及真空技術製作之UBM”，真空科技",[link]
  8. 劉業繡;林光隆,"”焊錫可靠度分析”， 電子月刊",[link]
  9. 林光隆,"”無煙助熔劑之研發”，飛躍的台鍍",[link]
  10. 林光隆,"”電子構裝覆晶接合技術” 科儀新知",[link]
  11. 林光隆,"“電子構裝「無構裝」化趨勢”，電子月刊",[link]
  12. 陳俊仁;林光隆,"”銲錫性之量測-潤濕天平”，銲接與切割",[link]
  13. 林光隆,"“覆晶接合技術與其銲錫隆點製程”，電子月刊",[link]
  14. 林光隆;鍾富智;李汝桐,""蘭嶼核廢料貯存壕溝貯存桶熱浸鍍鋅、鋁鋅耐蝕壽命"，防蝕工程",[link]
  15. 溫麗箱;陳俊仁;林光隆,""無鉛焊錫的簡介及未來的展望"，電子資訊",[link]
  16. 林光隆,""熱浸鍍鋅製程、規格、原理與物件設計"，熱浸鍍鋅",[link]
  17. 林光隆,""熱浸鍍鋅相關報導及研發趨勢分析",熱浸鍍鋅",[link]
  18. 林光隆,""臺灣熱浸鍍鋅產業的發展與現況(1994)", 防蝕工程",[link]
  19. 黃新營;林光隆,""臺灣地區一般熱浸鍍鋅產品之市場分析與未來預測", 熱浸鍍鋅雜誌",[link]
  20. 林光隆;李汝桐,""臺灣熱浸鍍鋅工業現況",熱浸鍍鋅雜誌",[link]
  21. 何晉國;林光隆,""熱浸鍍鋅, 5% 鋁鋅於含氫氧化鈣環境中之適用性", 熱浸鍍鋅雜誌",[link]
  22. 林光隆,""美國金門大橋五十年的腐蝕研究", 熱浸鍍鋅雜誌",[link]
  23. 林光隆,""鍍鋅層剝落的成因與對策"熱浸鍍鋅雜誌",[link]
  24. 林光隆,""廢液中重金屬之回收與轉化", 資源再生及其污染防治技術研討會論文集",[link]
  25. 林光隆,""逆滲透膜於重金屬廢液處理之研究",金屬再生及其污染防治技術研討會論文集",[link]
  26. 林光隆,""在熱浸鍍鋅鋼筋混凝土池裡游泳", "鋅保護光纖管路", 熱浸鍍鋅雜誌",[link]
  27. 林光隆,""熱浸鍍鋅層的成長", 熱浸鍍鋅雜誌",[link]
  28. 林光隆,""熱浸鍍鋅耐蝕處理探討" 熱浸鍍鋅雜誌",[link]
  29. K. L. Lin,"Interfacial Charge, Micellization and Mass Transfer in Hydrometallurgical SolventExtraction : A Hydroxyoxime-Sulfonic Acid Mixed Extractant System",[link]
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